Latest thermal imaging of technology

Latest Thermal Imaging of Technology

The latest in thermal imaging technology packaged in an OEM configuration for rapid development into your designs. Infrared camera modules are available in a wide range of configurations from simple volts in video out modules to custom fully integrated digital interface. Most of the modules are based on latest generation uncooled Focal Plane Array detector cores. This proven technology provides for crisp imaging capabilities and robust reliable operation. With an NETD of .08C (Typical) the New Digital Detector cores are ready for the most discriminating of applications.

The New Bolometer is ready to go and this little guy packs some serious performance to cost ratio’s. The new bolometer core is very small, lightweight, and lean on the power consumption. This innovative system core is poised to revolutionize the thermal imaging market.

Specifications

Detector 320 x 240 uncooled Focal Plane Array

Spectral Response 7-14 micron

Start Up Time <30 seconds

Contrast / Brightness Automatic / manual gain / level / polarity or RS232 controlled

Optics 18mm 25mm 50mm 75mm 100mm 150mm Germanium

Ouptut Format NTSC / PAL compatible and Digital out

Digital Zoom 2x RS232 controlled

Size (18mm Lens) 3.7″L x 4″W x 4.9″H (94 x 102 x 125mm)

Weight (18mm Lens) 1.6lbs. (.73kg)

Operating Temperature -30C to 66C

Storage Temperature -40C to 80C